Introduction to IC packaging process

The packaging process is more complicated. There are about a dozen processes, such as grinding and dicing. The grinding film is to make the back of the wafer thinner and meet the packaging needs. The dicing is to enable the wafer through the metal blade. The film is divided into one grain; the film is fixed by the conductive glue to fix the chip and the lead frame; the bonding is to realize the circuit conduction between the pad and the frame of the chip; the plastic sealing is to package the product. The key process inside is “bonding and plastic sealing”, the bonding achieves our purpose, the plastic sealing guarantees the quality assurance and the reliability of the product.