I. Overview Traditional thermal conductive materials are mostly metals and metal oxides, as well as other non-metallic materials, such as graphite, carbon black, A1N, SiC, etc. With the development of science and technology and production, many products have put forward higher requirements for thermal conductive materials, hoping that they have better overall performance, light weight, strong chemical resistance, excellent electrical insulation, impact resistance, easy processing and molding, etc. . Thermally conductive and insulating polymer composites are more and more widely used because of their excellent comprehensive properties. However, most of the polymer materials are poor conductors of heat, which limits its application in thermal conductivity. Therefore, the development of new polymer materials with good thermal conductivity has become an important development direction of thermal conductive materials. Especially in recent years, with the rapid development of high-power electronic and electrical products, more and more problems will inevitably occur due to product heat generation, resulting in reduced product efficiency and shortened service life. According to some data, the reliability of electronic components decreases by 10% every time the temperature of electronic components rises by 2 ° C; the service life at 50 ° C is only 1/6 of that at 25 ° C. There are two main types of thermally conductive fillers: one is thermally conductive insulating fillers, such as metal oxide fillers and metal nitride fillers. The other is thermally conductive non-insulating fillers, such as carbon-based fillers and various metal fillers. The former is mainly used for electronic component packaging materials and other places that have high requirements for electrical insulation performance, while the latter is mainly used for chemical equipment heat exchangers and other occasions that have low electrical insulation performance requirements. The type of filler, particle size and distribution, the amount of filler and the interface properties between the filler and the matrix all have an impact on the thermal conductivity of the composite. The matrix polymers used in thermally conductive plastics are: PA (nylon), FEP (perfluoropolypropylene), PPS, PP, PI epoxy resin, POM, PS and PS and PE composite materials. The research status of polymer-based thermally conductive composites at home and abroad: polymer-based thermally conductive composites add thermally conductive fillers to improve the thermal conductivity of polymer materials. Generally, it is based on high molecular polymers (such as polyolefin, epoxy resin, polyimide, polytetrafluoroethylene, etc.), metal oxides with better thermal conductivity such as A1203, MgO, metals with good thermal conductivity and insulation properties Nitrides AIN, BN, and high thermal conductivity metal materials such as Cu, AI, etc. are thermally conductive fillers, which are compounded in a two-phase or multi-phase system. At present, companies in Europe, Japan and the United States have reported that mature products are being promoted. For example: Royal Dutch DSM Engineering Plastics launched the first new polymer since the 21st century: Stanyl? TC series thermally conductive plastics can be used for LEDs; becoming the leading global supplier of plastic heat management solutions for LED lighting applications American Advanced Ceramics and EPIC have developed BN / polybutene (PB) composite engineering plastics with a thermal conductivity of 20.35W / (m? K), which can be prepared by common processes such as compression molding, and can be mainly used for electronic packaging, Integrated circuit boards, electronic control components, computer housings, etc. In China, aluminum nitride epoxy resin (EP) thermally conductive composite materials were prepared by molding. The effects of AIN content, particle size, silane coupling agent and processing technology on the thermal conductivity of the system. The research shows that with the increase of A1N content and particle size, the thermal conductivity of the system continues to improve; the addition of coupling agent enhances the interface bonding properties of AIN and epoxy resin, and reduces the thermal resistance between the interfaces, which is beneficial to Improve the thermal conductivity of the system. When the particle size of AIN is 5.3 microns and the content is 67v01%, the thermal conductivity of AIN / EP thermal conductive composite material is 14W / (m? K). Vacuum Furnace Insulation Screen Vacuum Furnace Insulation Screen,Thick Hard Felt Disc,Thick Vacuum Furnace Plate,Thermal Insulation Screen For Vacuum Furnace HuNan MTR New Material Technology Co.,Ltd , https://www.hnmtr.com