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Affected by structural changes in the semiconductor market and the economic downturn, the number of exhibitors in the "SEMICON JAPAN 2009" (held from December 2nd to 4th) has decreased by nearly 40%, but it is one of the few expected growth areas. With the relevant equipment and components, major companies are still actively demonstrating. For example, Disco, which has set up the largest exhibition area, has exhibited a variety of LED backplane cutting devices. The wafer handling device not only has 200mm and 300mm handling devices, but also displays handling devices such as 50mm and 75mm for LEDs. In addition, there are many LEDs that are displayed on wafers, which attracts the attention of visitors.
Among them, Canon Machinery exhibited Die Bonder and Wire Bonder for LED. The solid crystal machine exhibited the company's new model "BESTEM-D10Sp". The "Twin Stamp" mechanism, which is equipped with a self-developed two-arm linkage, achieves a high-speed bonding of 0.18 seconds/Cycle while maintaining a simple mechanical structure. The wire bonding machine exhibited the recently adopted "ConnX LED" series from Kulicke & Soffa.
In the LED packaging device market, in order to improve production efficiency, users are increasingly demanding equipment to enter the assembly line. To this end, Canon Machinery meets this requirement by adding wire bonding machines to its lineup. In addition, the initial cooperation between Canon Machinery and Culliso Law is centered on the business cooperation of introducing each other's products to their respective customers, and in the future, "possible" (Canon Machinery) will develop to cooperate with the product level of both devices.
"BESTEM-D10Sp"
"BESTEM-D10Sp" performance, etc.
"ConnX LED" 