OEM needs smaller and more diverse packaging options to meet product design challenges and maintain cost competitiveness in their respective markets. Ball grid array (BGA) packaging is becoming more and more popular to meet these design requirements. In addition, they are ideal solutions, because I/O connections are located inside the device, increasing the ratio of pins to PCB area. In addition, BGA with strong solder balls is stronger than QFP lead, so it is more robust.
With today's electronics technology, the demand for I/O availability poses a number of challenges, even for experienced PCB designers, due to multiple exit routes.
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One of North America’s largest connector distributors, Heilind, has been focusing on the distribution of connectors for almost four decades since its establishment, providing connector products from more than 100 leading manufacturers worldwide. Companies in various industries provide connector distribution services, and more than 75% of their business revenue comes from connectors. Of the thousands of component distributors in the global electronics industry, there is not much to focus on single-type devices, and there are fewer specialized distributors who can focus on connectors.
Last year, Helende entered Asia for the first time, set up its Asia Pacific headquarters in Hong Kong, China, and gradually settled in major cities in Mainland China. Recently, Helende teamed with its top five international leading brands to participate in the China (Chengdu) Electronics Show. For the first time, he showed the leading products and professional services that North American's largest connector distributors can provide to Chinese companies.
"It is very difficult to do fine work, so we have always focused on the distribution of connector products. We hope to bring more professional and detailed products and services to our customers." Shen Yucheng, president of Helend Asia Pacific, accepted The author's interview pointed out that "As a professional connector distributor, we are willing to invest in various connector-related equipment and provide many value-added services based on professional equipment. This is our advantage." According to reports, Helend The United States and Hong Kong respectively set up value-added service centers and distribution centers to respond quickly to customers' stocking needs.
Heilind, a professional distributor, focuses on SME connector requirements. In addition, Helend Electronics has been praised by customers and suppliers for its strong inventory, flexible policies, sensitive systems, and convenient and efficient supply chain management. “Helende will not set minimum batches for customers. Most of the small and medium-sized customers usually need small batches. Our very flexible strategy can exactly meet the customer's minimum demand for connectors.†Shen Yucheng stated, “Helende is in North America. We have set up five warehouses with Asia-Pacific and have the world's largest connector inventory, so we can quickly meet the customer's order requirements. This is a major feature of Hellender.†In addition, the long-term cooperation between Hellender and suppliers It is also convenient to customize products to suppliers based on their special needs. Some of the unique needs of customers have also become very effective feedback channels for these suppliers' market needs. These qualities and advantages of Helende have also been highly recognized by TE, Molex, EDAC, Emerson, and AlphaWire, which were exhibited on the same platform.
"We expect Helend to bring its technology and service advantages in the North American market to the Chinese market." - TE product manager Zhou Feirong said connector, TE is a brand that has to be said. TE connectors play an important role in areas such as automotive, power, industrial, broadband communications, consumer electronics, medical electronics, and aerospace. According to official data, TE has a global total of more than 90,000 employees, 20 R&D centers, annual sales of 13.3 billion U.S. dollars, and R&D investment of over 688 million U.S. dollars.
It is reported that TE has entered the Chinese market for 25 years since the market continued to grow strongly. So far China has annual sales of more than 2 billion US dollars, accounting for 15% of TE's global market share. “More and more Chinese companies have noticed the importance of high-quality connectors. This requires manufacturers of electronic components to work together with home appliance designers and manufacturers to develop innovative, cost-effective systems and solutions to meet Energy standards, and to attract consumers." Zhou Feirong said. TE's newly launched Triple Lock Connector is the best embodiment for TE to listen to customer needs, continuously improve the design system, and help customers develop their global business. In response to the needs of many home appliance manufacturers, this new connector implements a variety of design attributes including ease of connectivity, ease of maintenance, flexibility, and overall improved robustness. "In fact, there are many other examples. TE's connectors can guarantee no replacement during the product life cycle. With the rapid increase in industrial upgrading and labor costs, this high quality brings almost zero after-sales costs to Customers have brought greater value." Zhou Feirong pointed out.
"More and more SMEs need TE's professional products and services, and as a professional connector distributor, Helend has the rich experience and resources to serve SME connector requirements, so Helende came to Asia and we are very "Let's see!" said Zhou Feirong. "We highly value Helende's tremendous role in the distribution of TE products and hope that Helende and TE will bring extraordinary value to Chinese companies."
"In 47 years, our leading product did not have a fault report in customer applications" - Bob Sakitkovski, Vice President of EDAC Group
"The EDAC Group and Helende are all 100% private companies. We all believe in the value that the service brings to our customers." Bob Sakitkovski, Vice President of the EDAC Group, shared with the author at the Electronics Show. Headquartered in Canada, EDAC Group, EDAC, MH and NORCOMP are the three major connector brands of the Group, providing customers with a complete and complementary connector solution: EDAC main products are matrix connectors, card slot connectors, each Communication jacks and custom connectors. Norcomp mainly produces a variety of high-end Dsub; MH mainly produces a variety of high-quality metal and plastic D-sub shell, and provide a variety of outlets.
"Our products have been widely used in nuclear energy, wind energy, high-speed transportation systems, etc." Bob pointed out, "Electric power plants including China have been using EDAC's connector long ago. Our matrix connector has also been successfully applied at the Shanghai World Expo. In the large audio control system on the Guangzhou Asian Games Arena.†Bob highlighted the Group’s professional service capabilities in providing customized connector design and manufacturing, and shared a deep custom design of the connectors of the EDAC Group to participate in customer projects. Case - The EDAC Group's design team went deep into the product design site of one of Europe's leading wind energy equipment companies. Tailored a turbine control board connector tailored to the customer's requirements, which solved the customer's size, space, and The stringent requirements of reliability. "The EDAC Group has a global customer support service system that can be designed and modified to meet different customer needs. This is our advantage!" stressed Bob.
For Helende to enter Asia, it is clear that the EDAC Group is very supportive. As the vice president responsible for global operations, Bob was able to see Helende at the electronic fair. “In the 47 years, there has been no report of faults in customer applications for the leading product matrix connector of EDAC Group. Helend is a very professional connector distributor in the world. We have always had very good cooperation in North America. We expect to use Heliande's professional connector distribution advantages will introduce more high-quality EDAC Group products to Chinese users, Bob said.
"Our strength lies in high speed, high density, high stability, and reliability." - Wei Tianfeng, senior technical support engineer at Molex In the connector market, the number two Molex name in the world is loud enough in the industry. "Our advantage lies in high speed, high density, high stability and reliability." Wei Tianfeng pointed out. Because of these outstanding characteristics, Molex's connectors are widely used in the world's leading communications systems. There are many big names in Molex's long-term cooperating customers list. "In addition to telecommunications and data communications industries, Molex products are also widely used in industrial, aerospace, automotive, medical, lighting, etc. In particular, Molex is particularly valued in the medical field. We will bring more innovative connector solutions to the industry. Therefore, we set up a team for medical product design in Shenzhen specifically,†said Wei Tianfeng.
As a connector giant, Molex offers a wide variety of standardized connector products that are widely used in the industry, and Molex is as far away as custom product services. “We provide customized connectors solutions for many companies to help them achieve breakthrough system performance, and these innovative connector designs can also be used by other companies after the technical protection period, bringing them technically Advantages: For example, the 40-gigabit backplane connector designed by Molex is a 72-core fiber connector developed for a communication equipment manufacturer..." Wei Tianfeng shared. According to him, customized design services account for nearly 20% of Molex's global sales.
Ball Grid Array (BGA), a type of surface-mount packaging (a chip carrier) used for integrated circuits.
Ball-Grid Array (BGA) Packages Become PCB Design Mainstream
BGA PCB Design Guidelines And Rules
BGA PCB Design Rules
In order to keep up with the technological progress of chip manufacturers, BGA software packages for embedded design have made remarkable progress in the past few years.
This special type of packaging can be decomposed into standard BGA and micro BGA.
Correct BGA partitioning first takes into account uniformity of the partitioning, itself. Because, precise BGA partitioning on a PCB is a crucial design aspect to minimize or eliminate crosstalk and noise, as well as manufacturing issues.
Memory signals need special consideration during BGA partitioning. They need to be away from oscillating signals and power supply switching. This is important because memory signals needs to be clean. If traces carrying these signals are in the proximity of oscillating signals or switching power supply signals, they produce ripples in the memory signal traces, thereby reducing system speed. The system is operational, but at less than optimal speed levels.
BGA PCB Design Guidelines
BGA Design Strategy 1: Define an appropriate exit path
The main challenge for PCB designers is to develop appropriate exit routes without causing manufacturing failures or other problems. Several PCBs need to ensure proper fan-out wiring strategies, including pad and pass size, I/O pin number, layers required for fan-out BGA and line width spacing.
BGA Design Strategy 2: Identify the Layers Required
Another question is how many layers the PCB layout should have, which is by no means a simple decision. More layers mean higher overall cost of the product. On the other hand, sometimes you need more layers to suppress the amount of noise PCB may encounter.
Once the alignment and space width of PCB design, the size of through holes and the alignment in a single channel are determined, they can determine the number of layers they need. Best practice is to minimize the use of I/O pins to reduce the number of layers. Usually, the first two outer sides of the device do not need through holes, while the inner part needs to arrange through holes below them.
Many designers call it dog bones. It is a short path of the BGA device pad, with a through-hole at the other end. The dog bone fan comes out and divides the equipment into four parts. This allows the remaining internal padding to be accessed by another layer and provides escape paths away from the edge of the device. This process will continue until all mats are fully developed.
BGA Package Types
There are six different BGA packages.
1. Moulded Array Process Ball Grid Array (MAPBGA): It is a BGA package which provides low inductance and simple surface mounting.
2. Plastic Ball Grid Array (PBGA): Again, this BGA package provides low inductance, simple surface mounting, high reliability and is cheap.
3. Thermally Enhanced Plastic Ball Grid Array (TEPBGA): Just like its name sound, this BGA package can handle great levels of heat dissipation. Its substrate has solid copper planes.
4. Tape Ball Grid Array (TBGA): You can use this BGA package as a solution for medium- to high- end applications.
5. Package on Package (PoP): It will permit you to put a memory device on some base device.
6. Micro BGA: This BGA package is quite small when compared with standard BGA packages. Currently, you will see 0.65, 0.75 and 0.8 mm pitch size dominating in the industry.
BGA PCB Assembly
Previously, Engineers were not sure whether PCB BGA assembly would be able to achieve the reliability level of traditional SMT methods. However, at present, this is no longer a problem, because BGA has been widely used in Prototype PCB assembly and mass production PCB assembly.
You will need to use reflow methods to solder a BGA package. Because only reflux method can ensure solder melting under BGA module.
We have a wealth of experience handling all types of BGAs, including DSBGA and other Complex Components, from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. We are capable of placing minimum 0.4 mm pitch BGAs on your PCB.
PCB BGA Advantages
With PCB BGA, you will get the following advantages:
1. BGA package eliminates the issue of developing small packages for ICs with lots of pins.
2. Again, when compared with packages with legs, The BGA package has a lower thermal resistance when placed on the PCB.
3. Do you know which property causes unwanted signals distortion in high-speed electronic circuits? The unwanted inductance in an electrical conductor is responsible for this phenomenon. However, BGAs have very little distance between PCB and the package which in turn leads to lower lead inductance. Thus, you will get top-class electrical performance with pinned devices.
4. With BGAs, you can effectively utilize your Printed Circuit Board space.
5. Another advantage that will come with BGA is the reduced thickness of the package.
6. Last but not least, you will get enhanced re-workability because of bigger pad sizes.
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