1. TSMC's 7nm Process and Winning a Major Broadcom AI Chip Order; Broadcom has introduced a silicon-proven 7-nanometer IP core, aimed at high-demand areas such as artificial intelligence (AI), 5G, and high-bandwidth networks through specialized application chips (ASICs). The 7nm ASIC developed by Broadcom for its clients was finalized at the end of last year, and the company has also decided to outsource the foundry and CoWoS packaging work to TSMC. TSMC’s 7nm process is leading the industry, with major players like Apple, AMD, and Qualcomm all adopting it for their next-generation chips. Broadcom is now following suit, leveraging the 7nm process to build an ASIC platform targeting AI and high-speed networking markets, which are experiencing strong growth. Broadcom has built an ASIC platform based on TSMC’s 7nm technology and announced the availability of 7nm-certified IP cores, including high-speed SerDes, HBM Gen2/Gen3 PHYs, Die2Die PHY, mixed-signal IP, and basic silicon IP. The processor core of the ASIC platform uses ARM and peripheral IP cores. In addition to targeting AI applications like deep learning and entering the high-performance computing (HPC) chip market, Broadcom’s 7nm ASIC will integrate memory such as HBM Gen2/Gen3 directly into the chip using TSMC’s advanced CoWoS packaging. High-speed SerDes IP will support high-speed switches, routers, and 5G-enabled system-on-chip (SoC) designs. Broadcom confirmed that the 7nm ASIC for its key pre-customers was completed at the end of last year. For TSMC, 7nm is a major focus this year. With increased production capacity, TSMC expects a sharp rise in output after the second quarter. CEO Wei Jen-Jia mentioned that TSMC has 10 chips in the 7nm process nearing design completion, with mass production expected in the second quarter. Another 10 chips are expected to finalize design in the first quarter. By the end of the year, more than 50 7nm chips are anticipated, covering mobile devices, gaming, CPUs, FPGAs, Netcom, and AI applications. TSMC expects revenue in the first half of the year to grow slightly above 15% compared to the same period last year. Revenue is projected to be slightly lower in the second half, but with the full recognition of 7nm revenue starting in the third quarter, TSMC could see revenue jump over $9 billion, potentially reaching $10 billion in the fourth quarter. 2. After iPhone X, Who Are the Big Winners in 3D Sensing? Following the release of the iPhone X, 3D sensing has become a hot topic in the smartphone industry. The iPhone X eliminated the Home button, replacing it with Face ID, making 3D sensing a key feature and setting a new standard for smart device innovation. The potential for 3D sensing in smartphones is increasing rapidly. With the iPhone X leading the trend, other manufacturers are expected to follow. Reports suggest that high-end Android models in 2018 will include 3D sensing features, boosting their value and competitiveness. Beyond smartphones, 3D sensing can extend to laptops, personal computers, robotic vacuum cleaners, and even AR/VR, drones, and self-driving cars—making it a future-focused technology. As the market grows, many supply chain companies are likely to benefit from the rising demand. The concept of 3D sensing was first used in Microsoft’s Kinect gaming console. With growing interest in AR/VR, Apple acquired PrimeSense in 2013 to explore the use of 3D sensing in smartphones. While earlier smartphones only featured 2D technology, the Galaxy S8 in 2017 did not include 3D sensing. However, several Taiwanese component suppliers have seen significant growth, especially those involved in optical modules and packaging processes. Some companies, like VESCEL, have experienced a surge in revenue due to 3D sensing demand. Despite some quarterly losses, there are expectations for improved performance in the coming quarters. Additionally, the integration of 3D sensing on the back panel is expected to be released in 2018, further expanding the market. 3. Main Challenges Facing China’s 5G Chips;
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