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In response to the growing demand for higher bandwidth, increasing design complexity, new manufacturing processes, and the integration of multidisciplinary technologies, the semiconductor industry is undergoing rapid growth and transformation. These changes are happening at an accelerated pace, with shorter development cycles and more intense competition. In other fields like software and hardware, similar challenges have been tackled through open alliances and standardized frameworks. For example, initiatives such as the Open Compute Project, Open Data Path, and the Linux Foundation have fostered collaboration and innovation. However, one area that still lacks this open approach is the Multi-Chip Module (MCM), where multiple chips are integrated into a single package to form a complete system.
The MCM concept has been around for some time and offers several technical and market advantages. One key benefit is higher yields. By splitting large silicon wafers into smaller chips, manufacturers can avoid the high costs and low yields associated with producing large single-chip designs. This not only improves individual component yields but also enhances the overall system efficiency and reduces costs. Additionally, MCMs allow for process optimization, enabling different components to be manufactured using the most suitable processes for their specific functions. This flexibility also extends to production lines, which can be tailored to produce unique features for different products.
Another advantage is the ability to quickly create new products by combining various types and quantities of devices, leading to innovative and cost-effective solutions. MCMs also shorten product development cycles because each chip can be upgraded independently without requiring a full redesign of the entire system. This makes it easier to add new features or fix issues in specific parts of the system while keeping stable components unchanged.
Moreover, MCMs support economies of scale, as individual chips can be reused across multiple applications, boosting production volumes and improving return on investment. As the industry moves toward smaller footprints, lower power consumption, and higher performance, MCMs are becoming a promising solution for next-generation printed circuit boards (PCBs).
Imagine if these benefits could be shared across the entire industry, not just by a single supplier. By opening up and standardizing chip interfaces, a truly open platform could emerge, allowing companies with diverse expertise to collaborate and develop new products together. This is the vision behind the USR Alliance.
The USR Alliance has introduced ultra-short-range (USR) links optimized for communication between components within a single package. Unlike existing very short-range (VSR) physical layers that span package boundaries and connectors, USR links offer higher bandwidth, lower power consumption, and a smaller footprint. They are based on multi-line differential signaling and are specifically designed for MCM environments.
USR links can be used in a wide range of applications, including CPUs, switches, routers, FPGAs, DSPs, analog components, and long-range electro-optical interfaces. The alliance is working with industry leaders and standards organizations to define PHY, MAC, and software standards, as well as interoperability protocols. Their goal is to build a comprehensive ecosystem that supports the widespread adoption of USR technology, including certification programs to ensure compatibility across the board.
Marvell, as a key advocate of the USR Alliance, is actively building an ecosystem of interoperable components, interconnects, and software. This effort aims to bring greater value to the semiconductor market and drive innovation through collaboration.